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10 15 20 25 30 35 40 45 50 48 correspondent contact of the chip or circuit to provide the relevant current, i.e. in mA. Another method is claimed of building a chemo-nuclear, bio-nuclear and/or bio-chemical plasma reactor, as per claimed method 1,2 and 7, with at least two terminals, which may give an other current (mA) or voltage. We claim also the method to power a computer and/or display system (i.e. monitor, a TV-unit) by a TIPlI-reactor as described in claim 1 or 2. We claim also the method to build an electronic component like a micro- chips (190), an integrated circuit (160), a transistor, a capacitor, a diode, a triode, etc., where said electronic component has inside (187) his embodiment at least one chemo-nuclear, bio-nuclear and/or bio-chemical plasma reactor (162) which is a reactor, as described in claim 1 or 2, and where inside channels (172), chambers (177, 179) in one or more layers (171A, 171B, 171C) - made by mould-injection, by photographic means, by printing technology, by etching chemically, by engraving, by laser or by similar processes — contain and transport liquids (125), gasses and plasma, and currents, where these current(s) may be picked up by one or more terminals (118, 178) to be delivered to at least one electronic (185, 176, 175, 186) part of said electronic component. We claim also the method (Fig. 18 and 19) to build an electronic component like a micro-chips (190), an integrated circuits (160), a transistor, a capacitor, a diode, a triode, etc., where a surface of said electronic component (190) is connected (i.e. glued) with at least a surface of one chemo-nuclear (170, 181), bio-nuclear and/or bio-chemical plasma reactor (162) which is a reactor, as described in claim 1 or 2, and where inside channels (172), chambers (173, 177, 179) in one or more layers (171A, 171B, 171C) - made by mould-injection, by photographic means, by printing technology, by etching chemically, by engraving, by laser or by similar processes — contain and transport liquids (125), gasses and plasma, and currents, where these current(s) may be picked up by one or more terminals (178, 179) to be delivered to at least one electronic (191, 192, 193, 194, 195, 196) part of said electronic component; We claim also electronic components, as described in claim 123 132, where additional material(s) as described in claim 1 and 14, can be inserted or where produced material(s) been redraw through opening/closure means (174), like gates. Method to build a cooled electronic component like a micro-chips (200), an integrated circuit (160), a transistor, a capacitor, a diode, a triode, etc., where a surface or an inside part of said electronic component (190) is equipped with at least one cooling element (201) powered by at least one chemo-nuclear (170, 181), bio-nuclear and/or bio-chemical plasma reactor (162) which is a reactor, as described in claim 1 or 2; Method to build electronic components like a micro-chip (200), integrated circuit (160), a transistor, a capacitor, a diode, a triode, etc., in which at least one layer of atomic carbon, created by the method as described in