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Page 31 of 56
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10 15 20 25 30 35 40 45 50 55 83 103. Reactor, as described in claim 1 or 2, here the wall of the containment can be used - in conjunction with the content of the chemical material and the ionization plasma - to created or withdraw and recycle material molecules to generate new liquid and/or solid matters (i.e. like the atomic elements, molecules or different elements...); 104. Method to build electronic computing means (i.e. microchip, integrated circuit, sensors, motherboard, etc.), for various electronic applications, powered by a static chemo-nuclear, a bio-nuclear and/or bio-chemical plasma reactor which are located either: a. onthe surface of said electronic computing means, b. in the inside embodiment of said electronic computing means; Cc. connected to said electronic computing means by direct and/or Indien at aaenann. Maw anne indirect connection means, d. Encapsulate the inside positioned electronic means, e. a combination of above-mentioned locations, where said static chemo-nuclear, bio-nuclear or bio-chemical plasma power means, as per claimed method 1,2 and 7, - located in one or more embodiments which may have each one or more layers - generate electrical current by the interaction of moving atomic and/or molecular elements (i.e. atomic hydrogen) with at least one type of nuclear element in one or more cavities and/or internal channels, can be a single unit or a multi-system at least have one embodiment; 105. Method to power directly a microchip or an integrated circuit or parts of a microchip or of an integrated circuit, by at least one static, dynamic or rotational chemo-nuclear, bio-nuclear and/or bio-chemical plasma reactor, as per claimed method 1, 2 and 7, build within the microchip or integrated circuit; 106. Method to power directly a microchip or an integrated circuit or parts of a microchip or of an integrated circuit, by at least one static, dynamic or rotational chemo-nuclear, bio-nuclear and/or bio-chemical plasma reactor, as per claimed method 1, 2 and 7, located outside the microchip or integrated circuit; 107. Method to join (i.e. laminate) a surface of a chemo-nuclear, bio-nuclear and/or bio-chemical plasma reactor, as described in claim 1, 2 and 7, in with at least one surface of a microchip or integrated circuit in such a way that at least one electric current terminal of the reactor contacts a correspondent contact of the chip or circuit to provide the relevant current, i.e. in mA; 108. Method of building a chemo-nuclear, bio-nuclear and/or bio-chemical plasma reactor as described in claim 1, 2 and 7, with at least two terminals, which may give an other current (mA) or voltage; 109. Method to power a computer, a TV-unit and/or display system (i.e. monitor) by a reactor, as described in claim 1 or 2; 110. Method where all above-mentioned methods can be used created in a vacuum, pressurized or atmospheric conditions, which can be rotating